Apparatuses and methods for manipulating droplets

ABSTRACT

Apparatuses and methods for manipulating droplets are disclosed. In one embodiment, an apparatus for manipulating droplets is provided, the apparatus including a substrate, multiple arrays of electrodes disposed on the substrate, wherein corresponding electrodes in each array are connected to a common electrical signal, and a dielectric layer disposed on the substrate first side surface and patterned to cover the electrodes.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of co-pending U.S. patent applicationSer. No. 11/343,284 filed Jan. 30, 2006 which claims priority to U.S.Provisional Patent Application No. 60/648,051 filed Jan. 28, 2005. Thisapplication also is a continuation-in-part of co-pending U.S. patentapplication Ser. No. 11/965,152 filed Dec. 27, 2007 which was acontinuation of U.S. patent application Ser. No. 11/077,569 filed Mar.10, 2005 (now U.S. Pat. No. 7,569,129 issued Aug. 4, 2009) which was adivisional of U.S. patent application Ser. No. 10/253,368 filed Sep. 24,2002 (now U.S. Pat. No. 6,911,132 issued Jun. 28, 2005). The disclosureof the aforementioned patent applications and the other patents andpatent applications discussed herein are incorporated herein byreference in their entirety.

BACKGROUND OF THE INVENTION

1. Technical Field

The presently disclosed subject matter relates generally to apparatusesand methods for manipulating droplets. More particularly, the presentlythe use of apparatuses comprising multiple arrays of electrodes disposedon a substrate wherein corresponding electrodes in each array areconnected to a common electrical signal.

2. Background

Microfluidics is a rapidly advancing field which deals with the study ofsub-microliter fluids. Microfluidic devices are increasingly findingapplication and acceptance in many fields of biology, chemistry,medicine, environmental monitoring, drug discovery, and consumerelectronics. Miniaturization of traditional devices, particularlyanalytical devices, is expected to lead to many benefits includingreduced consumption (and cost) of reagents and samples, higherthroughput and automation, faster analysis times, and more reliable,inexpensive, and portable instrumentation. As more functionality becomesembedded within these devices, fully integrated micro-total-analysissystems (μTAS) or labs-on-a-chip are becoming a reality and increasinglyimportant.

Lab-on-a-chip is an emerging paradigm which aims to miniaturize andintegrate fluid-handling onto a chip. A lab-on-a-chip should enablefluid dispensing, transport, mixing, incubation, detection/separation,and waste disposal for it to be a truly self-contained unit.Microfluidic lab-on-a-chip systems can be broadly categorized intocontinuous-flow and discrete-flow systems. A continuous-flow system isself-descriptive and in discrete-flow systems the fluid is discretizedinto droplets. A common limitation of continuous flow systems is thatfluid transport is physically confined to fixed channels, whereasdroplet-based (or discrete-flow) systems can be either confined tophysical channels or operate on planar and channel-less systems. Thetransport mechanisms generally used in continuous-flow systems arepressure-driven by external pumps or electrokinetically-driven byhigh-voltages. Continuous-flow systems can involve complex channelingand require large supporting instruments in the form of external valvesor power supplies. In another approach to channel-based systems,centrifugal forces drive the fluids to flow uni-directionally inchannels. The continuous-flow microfluidics paradigm has limitations inversatility, making it difficult to achieve high degrees of functionalintegration and control.

Discrete-flow or droplet-based microfluidic systems have beenprogressing steadily to fulfill the promise of the lab-on-a-chip conceptto handle all steps of analysis, including sampling, sample preparation,sample-processing including transport, mixing, and incubation,detection, and waste handling. These steps have been designed to beperformed on-chip without significant off-chip support systems. A fewdiscrete-flow approaches have been recently developed for manipulatingdroplets based on multilayer soft lithography, hydrodynamic multiphaseflows, continuous electrowetting, electrowetting-on-dielectric (EWOD),dielectrophoresis, electrostatics, and surface acoustic waves. Some ofthe above techniques manipulate droplets or slugs in physically confinedchannels while other techniques allow manipulation of droplets on planarsurfaces without any physically defined channels. The channel-lessdroplet-based approaches have been referred to as “digitalmicrofluidics” because the liquid is discretized and programmablymanipulated.

Droplet-based protocols are very similar to bench-scale biochemicalprotocols which are also generally executed on discrete volumes offluids. Therefore, established protocols can be easily adapted todigital microfluidic format. Some of the distinguishing features ofdigital microfluidic systems include: reconfigurability (dropletoperations and pathways are selected through a software control panel toenable users to create any combination of microfluidic operationson-the-fly); software programmability also results in design flexibilitywhere one generic microfluidic processor chip can be designed andreprogrammed for different applications; conditional execution steps canbe implemented as each microfluidic operation can be performed underdirect computer control to permit maximum operational flexibility;multidirectional droplet transport since the channels only exist in thevirtual sense and can be instantly reconfigured through software; smalldroplet volumes (<1 μL); completely electronic operation without usingexternal pumps or valves; simultaneous and independent control of manydroplets; and channel-less operation (where no priming is required).

Many current lab-on-a-chip technologies (including both continuous-flowand discrete-flow devices) are relatively inflexible and designed toperform only a single assay or a small set of very similar assays. Dueto the fixed layouts of current microfluidic chips, a new chip design isrequired for each application, making it expensive to develop newapplications. Furthermore, many of these devices are fabricated usingexpensive microfabrication techniques derived from semiconductorintegrated circuit manufacturing. As a result, applications formicrofluidic devices are expanding relatively slowly due to the cost andeffort required to develop new devices for each specific application.Although batch fabrication allows microfabricated devices to beinexpensive when mass-produced, the development of new devices can beprohibitively expensive and time consuming due to high prototyping costsand long turn-around time associated with standard semiconductormicrofabrication techniques. In order to broaden the range ofapplications and impact of microfluidics in medicine, drug discovery,environmental and food monitoring, and other areas including consumerelectronics, there is a long-felt need both for microfluidic approacheswhich provide more reconfigurable, flexible, integrated devices, as wellas techniques for more inexpensively and rapidly developing andmanufacturing these chips.

Over the past several years there have been advances utilizing differentapproaches to microfluidics based upon manipulation of individualnanoliter-sized droplets through direct electrical control. Examples ofsuch systems can be found in U.S. Pat. No. 6,911,132 and U.S. PatentApplication Publication No. 2004/0058450, both to Pamula et al. (andcommonly assigned to the Assignee of the present subject matter), thedisclosures of which are incorporated herein by reference. Thesetechniques offer many advantages in the implementation of the digitalmicrofluidics paradigm as described above but current fabricationtechniques to produce these microfluidic chips still depend on rathercomplex and expensive manufacturing techniques. These microfluidic chipsare currently produced in microfabrication foundries utilizing expensiveprocessing steps based on semiconductor processing techniques routinelyused in the integrated circuit (IC) fabrication industry. In addition tohigher cost for semiconductor manufacturing techniques, semiconductorfoundries are not easily accessible and typically do not offerfabrication or prototyping turn-around times of as quick as 24 hours.

Microfluidic chips are generally fabricated using custom processes basedon traditional semiconductor microfabrication procedures. Devices arefabricated on glass substrates through repeated steps of thin filmdeposition and patterning using standard photolithographic techniques.Typically, at least two metal layers (one for electrodes and one forwiring) are required in addition to two or three insulator layers, aswell as layers for forming the standoff between the top and bottomplates. Due to the high cost of photomask fabrication and chipmanufacturing, a single prototyping run producing up to 100 devices cancost as much as $10,000 and require three months to complete dependingon the number of photolithographic levels. Furthermore, since theprocess flow is not standardized, device yields tend to be very lowduring the first several attempts to fabricate any new design.

The expense and time required for prototyping has been a seriousimpediment to the development and optimization of droplet-basedmicrofluidics. Furthermore, the high chip costs and inability to rapidlycustomize or improve device designs is expected to dampen the commercialprospects of this versatile technology. In the short term, a more rapid,reliable and low cost fabrication technology is required to acceleratedevelopment and user acceptance of these devices. Since microfluidicstructures tend to be relatively large and rarely test the limits ofsemiconductor manufacturing techniques, lower resolution, lower costbatch fabrication methods should be considered.

In particular, printed circuit board (PCB) technology offers manycapabilities and materials similar to traditional semiconductormicrofabrication though at much lower resolution. Layers of conductorsand insulators are deposited and photolithographically patterned andstacked together to create intricate multi-level structures. For thefabrication of digital microfluidic systems, it is believed that PCBtechnology offers an excellent compromise in terms of resolution,availability, cost and ease of manufacture. It is further believed thatan additional advantage of using a PCB as a substrate is thatelectronics for sensing, controlling or analyzing the device can beeasily integrated at very low cost.

Typically, the copper line width and line spacing is measured in mils(25.4 μm) in a PCB process, which is orders of magnitude higher than thesub-micron features generally achieved in a semiconductor fab.Typically, PCB processing does not require an expensive ultra-cleanenvironment as is required for semiconductor IC fabrication. The boardsare also generally made out of reinforced plastic, glass fiber epoxy,TEFLON®, polyimide, etc. as compared to silicon or glass which are usedas substrates for microfluidic devices microfabricated in asemiconductor fab. Also, in place of a semiconductor mask aligner,alignment can usually be performed manually for PCB processing.Inexpensive masks made out of transparencies or MYLAR sheets are used inplace of expensive chrome-on glass photomasks used in semiconductorfabs. In PCB processing, via holes are drilled either mechanically orwith a laser and then electroplated instead of etching and vapordeposition used in semiconductor processing which necessitates vacuumprocessing. Multiple wiring layers are generally obtained by bondingindividually patterned single boards together as opposed to using asingle substrate and building up the multiple layers or bonding wafersin a semiconductor fab. Broadly, these are the main differences betweena PCB fabrication process and a semiconductor fabrication process eventhough high-end PCB processes are moving towards adopting some of thesemiconductor processes (such as physical vapor deposition).

In today's highly competitive commercial environment, it is imperativethat products reach the marketplace quickly and cost-effectively,particularly in consumer electronics and medical diagnostics businesses.The present subject matter is related to utilizing printed circuit board(PCB) manufacturing techniques which are widely available, reliable,inexpensive and well-defined. By fabricating reconfigurable microfluidicplatforms with a reliable, easily accessible, and low-cost manufacturingtechnology, the development and acceptance of lab-on-a-chip devices formany potential applications in biomedicine and in other areas will bemore widespread and rapid.

The attractiveness of PCB technology as an inexpensive,well-established, flexible and easily accessible manufacturing processfor the development of microfluidic systems has already been recognizedby researchers working with more traditional continuous-flowmicrofluidic systems. For example, researchers have previouslydemonstrated a number of continuous-flow microfluidic devices based onPCB technology including a bubble detector, a pH regulation system, amicropump, and a capacitive pressure sensor. More recently, PCB devicesfor the manipulation and analysis of single cells by dielectrophoresishave also been reported, as have hybrid approaches in which a PCB isused to monolithically integrate silicon-based microfluidic devices.However, there remains a long-felt need for an inexpensive, flexible,and reconfigurable system for discrete-flow manipulation of droplets.

BRIEF SUMMARY OF THE INVENTION

In one embodiment, an apparatus for manipulating droplets is disclosed,the apparatus comprising a substrate, multiple arrays of electrodesdisposed on the substrate, wherein corresponding electrodes in eacharray are connected to a common electrical signal, and a dielectriclayer disposed on the substrate first side surface and patterned tocover the electrodes.

In another embodiment, an apparatus for manipulating droplets isdisclosed, the apparatus comprising a substrate, a top plate arranged ina parallel orientation relative to the substrate and separated therefromto define a gap between the top plate and the substrate, multiple arraysof electrodes disposed on the substrate, wherein correspondingelectrodes in each array are connected to a common electrical signal,and a dielectric layer disposed on the substrate first side surface andpatterned to cover the electrodes.

Methods for manipulating droplets are also disclosed. In one embodiment,a method of manipulating a droplet comprises providing an apparatuscomprising a substrate, multiple arrays of electrodes disposed on thesubstrate, wherein corresponding electrodes in each array are connectedto a common electrical signal, and a dielectric layer disposed on thesubstrate first side surface and patterned to cover the electrodes. Themethod also comprises providing a droplet on the substrate andactivating electrodes of the multiple arrays of electrodes to cause thedroplet to be manipulated.

In yet another embodiment, an apparatus for manipulating droplets isdisclosed, the apparatus comprising a substrate, a top plate arranged ina parallel orientation relative to the substrate and separated therefromto define a gap between the top plate and the substrate, multiple arraysof electrodes disposed on the substrate, wherein correspondingelectrodes in each array are connected to a common electrical signal,and a dielectric layer disposed on the substrate first side surface andpatterned to cover the electrodes.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a top plan and FIGS. 1B-1D are profile views of an embodimentof the present subject matter depicting a strictly co-planar arrangementon a PCB with filled or unfilled via holes within the electrodes;

FIG. 2A is a top plan and FIG. 2B is a profile view of an embodiment ofthe present subject matter depicting a substantially co-planararrangement on a PCB with filled or unfilled via holes within theelectrodes;

FIG. 3A is a top plan and FIG. 3B is a profile view of an embodiment ofthe present subject matter depicting an embedded co-planar arrangementon a PCB with filled or unfilled via holes within the electrodes;

FIG. 4A is a top plan and FIG. 4B is a profile view of an embodiment ofthe present subject matter depicting a parallel-plate or bi-planararrangement on a PCB with filled or unfilled via holes within theelectrodes;

FIG. 5 is a perspective view of a droplet positioned on a dense array ofelectrodes with via holes on a PCB for droplet manipulation inaccordance with the present subject matter (liquid reservoirs notshown);

FIG. 6 is an illustration depicting the front side of a PCB chip used totest droplet transport performance of different shapes and sizes ofdrive electrodes in accordance with the present subject matter;

FIGS. 7A-7D are illustrations depicting various electrode shapes inaccordance with the present subject matter;

FIGS. 8A-8B are illustrations of an embodiment of the present subjectmatter depicting front and back views, respectively, of a PCB chipdesign featuring a three-phase droplet conveyor and other structures fordispensing, storing and mixing droplets;

FIGS. 9A-9B are illustrations of another embodiment of the presentsubject matter depicting front and back views, respectively of a PCBchip design featuring a three-phase droplet conveyor and otherstructures for dispensing, storing and mixing droplets;

FIG. 10 is a graph depicting droplet transport characteristics(frequency vs. threshold voltage) of different shaped 1.5 mm electrodesin accordance with the present subject matter;

FIG. 11 is a graph depicting droplet transport characteristics(frequency vs. threshold voltage) of different shaped 1.0 mm electrodesin accordance with the present subject matter;

FIG. 12 is a graph depicting voltage stability of droplet transport overtime in accordance with the present subject matter;

FIG. 13 is a graph depicting minimum voltage requirements for droplettransport at a given switching frequency in accordance with the presentsubject matter; and

FIGS. 14A-14D are illustrations depicting time-lapsed imagesdemonstrating droplet transport and mixing in accordance with thepresent subject matter.

DETAILED DESCRIPTION OF THE INVENTION

A printed circuit board (PCB), also sometimes called a printed wiringboard (PWB), is a substrate used to interconnect electronic componentsusing conductive pads and traces patterned on the substrate. Typically,PCBs are made by adhering a layer of copper over the entire substrate,sometimes on both sides, (known as creating a “blank PCB”) then removingunwanted copper (e.g., by etching in an acid) after applying a temporarymask, leaving only the desired copper traces. Electrical connections(“vias”) between opposite sides of the substrate can be formed bydrilling holes through the substrate either mechanically or with a laserand metallizing the interior of the drill hole to provide a continuouselectrical connection between the two sides. Multilayer boards can becreated by bonding together individually processed substrates. Electrodelines in the copper layer are usually defined by etching copper from ablank PCB in a subtractive process while some foundries usesemi-additive and fully-additive processes where copper is built up onthe substrate by electroplating or other techniques.

As discussed above, digital microfluidics is a microfluidic approach inwhich discrete droplets of fluid are electrically manipulated upon asubstrate containing an array on electrodes. In a commonly usedconfiguration, the droplets are sandwiched between two parallel plateswhere the top plate physically confines the droplets and the bottomplate contains an array of individually addressable drive or controlelectrodes (or elements) which are electrically insulated. Typically,one or more reference electrodes (or elements) are also required tocontrol the electrical potential of the droplet. Reference electrodesmay be either provided on the same substrate as the drive electrodes(co-planar) or on an opposite plate (bi-planar). The space between thetwo plates surrounding the droplet is generally open and may be filledwith air or with an immiscible liquid to prevent evaporation. Examplesof immiscible liquids that may be used with aqueous droplets includesilicone oil, fluorosilicone oil or hydrocarbon oils. When the referenceelectrodes and drive electrodes are provided on the same substrate, theopposing plate does not serve as part of the electrical circuit, butserves only as a cover plate to physically contain the liquids and maynot be required for operation of the device.

Droplet actuation is achieved by applying a potential between thereference electrode and one or more of the drive electrodes. The appliedpotential can be DC or AC and the reference electrodes need not bephysically distinct from the drive electrodes. A droplet adjacent to anactivated control electrode will become attracted towards that controlelectrode and move towards it. Control electrodes may be sequentiallyactivated using user-defined patterns (possibly using an electrodeselector) to transport droplets along arbitrary pathways defined bycontiguous control electrodes. In addition to transport, otheroperations including merging, splitting, mixing, deforming anddispensing of droplets can be accomplished based on the design of thecontrol electrodes and patterns of activation.

A digital microfluidic processor is essentially comprised of an array ofcontrol electrodes with one or more reference electrodes. A completechip may include many other types of structures including channels,liquid reservoirs, top-plates, sensors, inlets, outlets, etc. Theelectrode array requires interconnections to electrically connectcertain electrodes together and to connect electrodes to contact padsfor connection to external circuitry. Previously, digital microfluidicchips were fabricated on glass or silicon substrates using thin-filmdeposition and photolithography techniques borrowed from semiconductormanufacturing. Multiple levels of electrical interconnect for wiringwere built-up by depositing and patterning successive layers ofconductors and insulators upon a single starting substrate. The presentsubject matter pertains to apparatuses and methods whereby digitalmicrofluidic processors can be advantageously constructed in a standardPCB process as opposed to a custom glass or silicon based process.

The presently disclosed subject matter takes advantage of the ease withwhich multiple layers of conductors can be generated in a PCB processversus a glass or silicon based process. This is essentially the casebecause in PCB processing the metal layers are manufactured on separatesubstrates which are laminated together at the end rather than built upsequentially on a single substrate.

The PCB digital microfluidic chip as envisioned herein can have one ormore wiring layers. The conductor wiring patterns are transferred ontothe PCB substrate by subtractive plating, panel plating, patternplating, or additive plating. When only one layer of wiring is used, allthe electrodes for droplet manipulation and the pads for electricalinput/output connections are made on a single-sided board which does notrequire any via holes. Generally, two or more wiring layers will berequired for complex droplet handling operations which necessitate usingmultilayer boards. Multilayer boards are assembled by bonding severaldouble-sided boards or by built-up/sequential boards which do notrequire mechanical drilling of holes (e.g., via holes are chemicallyetched or laser drilled and then electroless plated). By definition,double-sided boards have wiring on both sides of the boards which can befurther classified into boards without through-hole metallization andboards with through-hole metallization. The boards with through-holemetallization are further classified into plated through-holemetallization and filled through-hole metallization. In platedthrough-hole metallization, the holes are metallized by copper plating(e.g., electroplating or electroless plating or a combination thereof)and in filled through-hole metallization, the holes can be filled withconductive pastes such as copper paste, silver paste, conductive epoxy,etc.

In digital microfluidic chips, through-holes (or via holes) are drilledthrough the center of the drive electrodes on one side of a multi-layerboard to make electrical connections on the opposite side of the board.The foot print of a droplet is defined by the area of a drive electrode.In order to obtain small droplet volumes, the area of the driveelectrodes need to be minimized. Since via holes are drilled through thedrive electrodes, it is important to minimize the diameter of the viaholes including the pad/land diameter. Therefore, via holes play animportant role in defining the minimum volumes of droplets obtainable ina PCB process. The PCB industry is driving down the via hole sizes for adifferent reason which is to avoid blocking the wire routing channelsand to maximize the PCB surface area available for traces. Many built-upprocesses use small vias which are formed by punching through using anexcimer laser. There are a number of variations of the built-upprocesses used in the PCB industry including, but not limited to,Surface Laminar Circuits (SLC) where the vias are photoformed;DYCOstrate™ where the vias are dry-plasma etched in parallel; FilmRedistribution Layer (FRL) where the outermost dielectric isphotosensitive while inner layers constitute a regular multilayer board;Conductive Adhesive Bonded Flex (Z-Link); Built-up Structure System(IBSS) where the dielectric is photosensitive; Sequential BondingCores/Any-Layer Inner Via-hole (ALIVH) where a CO₂ laser is used todrill the vias and the holes are then filled with silver paste; CarrierFormed Circuits where separate circuits are prepared on stainless steelcarriers and then laminated onto an FR-4 prepreg; Roll Sheet Buildupwhere single-sided epoxy coated foils are laminated by rolling heat andpressure; and Sheet Buildup which is similar to roll sheet buildup butdouble sided or multilayer circuits are laminated. In one embodiment ofusing a built-up board (Z-Link) for digital microfluidic chips, multipleflex boards consisting of polyimide-backed copper foils can be laminatedtogether and then onto a rigid board to form a multi-layer board. Inthis case, the holes in each flex layer can be punched, laser-drilled orplasma-drilled. The holes interconnecting various layers can then befilled by conductive adhesive.

General Embodiments

With reference to FIGS. 1A-1D, 2A-2B, 3A-3B, 4A-4B, and 5, therequirements for adapting PCB processed substrates for dropletmanipulation will now be discussed in more detail. As will be discussedin further detail below, FIGS. 1A-1D relate to a PCB digitalmicrofluidic chip 10 including a strictly co-planar arrangement on a PCBwith filled or unfilled via holes within the electrodes; FIGS. 2A-2Brelate to a PCB digital microfluidic chip 20 including a substantiallyco-planar arrangement on a PCB with filled or unfilled via holes withinthe electrodes; FIGS. 3A-3B relate to a PCB digital microfluidic chip 30including an embedded co-planar arrangement on a PCB with filled orunfilled via holes within the electrodes; FIGS. 4A-4B relate to a PCBdigital microfluidic chip 40 including a parallel-plate or a bi-planararrangement on a PCB with filled or unfilled via holes within theelectrodes; and FIG. 5 depicts a droplet positioned on a dense array ofelectrodes with via holes on a PCB for droplet manipulation. FIG. 5generally shows the concept of the present subject matter wherein liquidsamples are digitized into discrete droplet(s) D which can then beindependently dispensed, transported, incubated, detected or reactedwith other droplets (the approach of “digital microfluidics”).

In each of the embodiments shown in FIGS. 1A-1D, 2A-2B, 3A-3B, and4A-4B, and as will be described individually in more detail below, a PCBsubstrate board 12 is provided, the board having a top first sidesurface 13 and a bottom second side surface 14. Drive control electrodes(or elements) 16, such as copper trace drive electrodes, can be providedon top surface 13 of PCB 12, and reference electrodes (or elements) 18,such as copper trace reference electrodes or a parallel plate referenceelectrode, can also be provided in a variety of configurations fordroplet manipulation. Soldermask, such as liquid photoimageable (LPI)soldermask, is typically used in traditional PCB processes as the outerlayer to protect copper lines from the action of etchants or plating orfrom solder during the placement of electronic components. However, inits utility for driving droplets according to the present subjectmatter, this outer layer is an insulator 22 that serves to insulate thedroplets from the potentials applied on drive and reference electrodes16, 18. Drive electrodes 16 are completely insulated by insulator 22,preferably a LPI soldermask or some other dielectric including temporarysoldermasks. Complete insulation means that drive electrode 16 iscovered on all sides including the edges. Insulator 22 (LPI soldermask)is applied using conventional processes which include, but are notlimited to, curtain coating, spin coating, spray coating, or screenprinting. In case there is a need for a reference electrode 18, some ofthe copper features can be left bare and not insulated to provide adirect reference potential to the droplets. This exposed portion is asclose to drive electrodes 16 as permitted by the PCB process which isdefined by the resolution of the copper features as well as theresolution of the soldermask and the registration of the soldermasklayer to the copper layer. The exposed portion of reference electrode 18may have an optional conductive surface finish which commonly includesimmersion silver, immersion gold, and electroless nickel/immersion gold(ENIG).

Substrate Material

As discussed above, electrostatic microfluidic devices of the presentsubject matter include a substrate board 12 which can be fabricated onalmost any board material commonly in use for the manufacture of PCBs.These materials include, but are not limited to, FR-2, FR-4, FR-5,polyimide, Kapton™, Rogers™, Duroid™, BT, cyanate esters andPolytetrafluoroethylene (PTFE). Rigid, rigid-flexible or flexiblesubstrates can be used as base material 12 for the fabrication of thesedevices.

Electrode Formation

The outermost conductive copper layer of the PCB is patterned to formthe drive electrodes required to manipulate liquid droplets by electricfields. Drive electrodes 16 may take a wide variety of shapes and formsdepending on the particular application. For example, arrays ofsquare-shaped electrodes, arrays of circular-shaped electrodes, arraysof hexagon-shaped electrodes, arrays of star-shaped and otherinterlocking or interdigitated electrode shapes, as well as elongatedelectrode structures can be used. Reference electrodes 18 can also bepatterned in the same conductive layer or in a separate conductive layeron the same substrate (co-planar) or can be provided on a separatesubstrate (bi-planar).

In one embodiment as shown in FIGS. 1A-1D, reference electrodes 18 canbe patterned in the same conductive copper layer as drive controlelectrodes 16 wherein insulator 22 is removed over portions of referenceelectrodes 18 to expose the conductive layer underneath. This patternpermits simultaneous electrical contact between reference electrodes 18and the liquid droplet. In this embodiment, reference electrodes 18 maybe located adjacent to or in between drive control electrodes 16.

In another embodiment as shown in FIGS. 2A-2B, reference elements 18 canbe formed as a separate conductive layer patterned directly on top ofinsulator 22. The conductive layer may be a thin metal film deposited byvacuum processing, electroless plating, electroplating, lamination orother means and patterned to form reference elements 18. Referenceelements 18 may take a variety of shapes and forms and may lie eitherdirectly above and/or to the side of drive elements 16 (i.e., referenceelements 18 need not be precisely aligned to drive control elements 16).In one arrangement, reference elements 18 may form a grid or mesh ofconductive lines superimposed over drive elements 16. In thisarrangement, reference elements 18 could electrically shield controlelectrodes 16 where they overlap, so the overlap should ideally beminimized when sizing and locating reference elements 18 relative todrive control elements 16. In another arrangement, the pitch of the gridis chosen to be less than, but not an integer factor of, the electrodepitch. This separate conductive layer arrangement may be realized usingadditive metal PCB processes where metal is deposited upon insulator 22or alternatively could be realized using subtractive processes wherereference elements 18 and drive elements 16 are formed on opposite sidesof a thin flexible circuit substrate. In the latter case, the flexiblecircuit substrate serves as the insulation for drive control elements 16and the flexible circuit can be laminated to a rigid substrate toprovide mechanical rigidity and to provide electrical interconnectionsfor the electrodes.

In a further embodiment as shown in FIGS. 3A-3B, reference elements 18can be provided in an embedded co-planar arrangement within drivecontrol elements 16. In such an arrangement, via holes 25 with plating26 can function as reference elements 18 in areas not covered byinsulator 22. Other via holes 24 with plating 26 covered by insulator 22can also be provided and function as described hereinbelow.

In another embodiment as shown in FIGS. 4A-4B, reference elements 18 canbe provided on a separate substrate as a parallel plate. Typically, thesubstrate containing drive electrodes 16 and the substrate containingreference elements 18 are placed in opposition to each other with a gapG between them to contain the liquid, thereby creating a sandwichstructure. An additional parallel-plate arrangement can include twoopposing surfaces that are electrostatic PCB microfluidic devices bythemselves (the upper “plate” can be a PCB having a top first sidesurface 13′ and a bottom second side surface 14′) and have driveelements 16 on both surfaces and reference elements 18 on at least onesurface.

Because very little current is needed to charge drive electrodes 16 forelectric field-based droplet manipulation, the conductive materialforming the electrodes can be substantially more resistive than istypically acceptable for PCB applications. Thus, a wide range ofdifferent types of conductors, besides copper, may be used. Thisincludes conductors which are typically considered unsuitable forforming pads and traces on PCBs. Similarly, the conductive layer may besubstantially thinner than is typically favored for PCBs. Ideally, theconductive layer should be as thin as possible to minimize thetopography of the conductive features which must be subsequently coveredby the insulating layer. Additionally, minimization of the conductorthickness promotes planarity of the PCB surface which is desirable forconsistent and reliable manipulation of droplets upon the surface. Theconductor thickness may be minimized by using a starting substratematerial with minimal conductor thickness (e.g., ¼ oz. or 5 μm layer ofcopper cladding) or by adding a polishing or etching step to reduce theconductor thickness prior to deposition of the insulator.

Electrode Interconnection and Vias

Conductive traces on PCB substrate 12 are used to make electricalconnections to drive electrodes 16 and reference elements 18. Each driveelectrode 16 or reference element 18 can be connected to one or moreother drive electrodes 16 or reference elements 18, to other electroniccomponents on the same PCB substrate 12, or to pads for externalconnection. In one arrangement, pads for external connection areprovided along an edge of the PCB and the PCB is adapted for use in anedge-card connector socket 28 (see FIGS. 8A-8B). In another arrangement,an array of pads is disposed on the surface of the PCB and the pads arecontacted using spring-loaded pins, test clips or a strip ofanisotropically conducting material 29 (see FIG. 9A). In yet anotherarrangement, a pin-header, socket connector or other discrete electroniccomponent is connected to the PCB to facilitate connection to anexternal circuit.

As shown in FIGS. 1A-1D, 2A-2B, 3A-3B, and 4A-4B, electrical connectionsbetween different conductive layers of substrate 12 can be made throughPCB methods as known in the art, whereby a hole or via hole 24 isdrilled through substrate 12 from the two conductive regions (topsurface 13 and bottom surface 14) on either side of substrate 12 andwhich are to be electrically connected. While shown as circles in thedrawings, it is understood that via holes 24 can be any shape such assquares, ovals, etc. that could be formed in substrate material 12. Theinterior of hole 24 can also be metallized by electroless plating orelectroplating or using other methods to form a plating 26(plated-through hole metallization) so that electrical continuity isestablished between the two opposite sides at the location of the viahole. As discussed above, conductive pastes (filled through-holemetallization) could also be used in lieu of plated through-holemetallization to establish electrical continuity.

In order to establish electrical connections between electrodes andtraces several approaches are available. In one approach, a wire ortrace leads away from the electrode on the same side of the PCB, thewire can then be routed if necessary through the substrate at a vialocation remote from the electrode. In another approach, vias are madewithin the electrodes. In this case a means for filling or covering thedrill hole may need to be provided to prevent liquid from entering orevaporating through the via drill hole. Via hole 24 may be plated shutusing electroless or electroplating or may be filled or covered using avariety of techniques and a variety of materials (conductive epoxy,non-conductive epoxy, transparent epoxy, or any other material). Afterfilling the via holes with any of these filler materials, the surface ofthe PCB can then be covered with copper by electroless or electroplatingto completely obscure the via hole to the droplets moving on thesurface.

In one approach, the hole is made small enough so that an insulatordeposited in liquid form, such as a traditional liquid soldermaskmaterial, is prevented from penetrating the hole by viscous or surfacetension effects, or it could be made large enough so that the liquidsoldermask can enter the via hole thereby forming a soldermask-filledvia hole 24′ (see FIG. 1B). Alternatively, an extra process step may beadded to fill the drill holes with an epoxy or similar material prior todepositing the insulator, thereby forming an epoxy-filled via hole 24″(see FIG. 1C), or a transparent epoxy-filled via hole 24′″ (see FIG.1D). Another approach is to use a dry film insulator material which“tents” the drill hole, effectively covering it and sealing the chipsurface. A possible disadvantage of several of these approaches is thatthey result in the formation of a non-conductive region within theborder of the otherwise conductive electrode which reduces the area ofthat electrode that can be used for electric field generation. In orderto address this issue, several techniques are available for producing aconductive filling, including the use of conductive epoxies to fill thehole and the use of electroless plating or electroplating to provide aconductive surface coating over a non-conductive filler material.Another alternative is to electroplate the drill hole so that it becomescompletely filled with metal. This approach may require a planarizationstep to remove the excess metal deposited on the substrate surface bythe greater amount of electroplating. Planarization and control of theconductor thickness on the substrate surface can be simplified in thiscase through the use of a “button-plating” process in which additionalmetal is only added in the region surrounding the via. The resulting“buttons” can be then be removed by polishing the surface of the PCB. Inthis method, substantial amounts of metal can be deposited within thedrill-holes without increasing the final thickness of the metal on thePCB surface.

Electrode Insulation

Referring further to FIGS. 1A-1D, 2A-2B, 3A-3B, and 4A-4B, driveelectrodes 16 are typically electrically insulated by insulator 22 toprevent the flow of direct electric current between the electrodes andthe conducting liquid when a DC potential is applied to the driveelectrodes. It should be noted that AC potentials could as well beapplied to the drive electrodes to enable electric-field induced dropletmanipulation. While any dielectric can be used, soldermask is typicallyused in traditional PCB processes to protect the copper lines on a PCBand to expose copper only where electronic components will be eventuallysoldered. The most straightforward approach for insulating driveelectrodes 16 is to use soldermask material (or other dielectric) aselectrical insulator 22. Both liquid and dry-film soldermasks aresuitable for use as electrode insulators 22. Photoimageable soldermasksare generally preferred because they can be readily patterned to provideelectrical access to reference elements 18 or contact pads underneathinsulator 22.

Soldermasks are available in two varieties: liquid photoimageable (LPI)or dry film soldermask (DFSS). LPI is not conformal. DFSS offers nearvertical sidewalls and has been reported for fabricating electroplatingmolds, sealing of fluidic channels and as a mask for powderblasting ofmicrochannels. However, DFSS has not been used to form liquid reservoirsor as a gasket material to provide a stand-off or seal between twoparallel plates as is envisioned in the present subject matter.

In certain applications, soldermask materials may not exist with thedesired combination of thermal, mechanical, electrical or opticalproperties. In these cases, the soldermask materials can be replacedwith or combined with other types of insulator materials. For example,spin-on materials such as polyimide, dip or spin or spray orbrush-coatable materials such as TEFLON® AF and Cytop™, vapor depositedor sputtered materials such as silicon dioxide, and polymers such asparylene may be applied to the PCB substrate.

As an alternative to soldermask for insulator 22, a thin layer ofparylene could be deposited in a physical vapor deposition (PVD) processas a dielectric. Parylene is the generic name for a family ofpoly(para-xylylene) polymers which includes parylene C, D, and N. Asused in this disclosure, parylene refers to any poly(para-xylylene)composition and mixtures thereof. A major advantage with parylene isthat it can be deposited as a conformal layer and at a thickness muchless than both LPI and DFSS. In PCB methods, LPI can be coated as thinas 0.5 mils (1 mil=25.4 μm) while pin-hole free parylene can be coatedas thin as 0.5 μm. Such a thin insulator layer reduces the requiredpotential for droplet actuation. In some applications, the dielectricwill have to be patterned to expose the copper electrodes. Parylene canbe patterned by reactive ion etching, plasma ashing, chemical etching,or by laser ablation. Alternatively, parylene can also be selectivelydeposited by masking the regions that need to be exposed by a tape (forexample, 3M® Mask Plus II Water Soluble Wave Solder Tape No. 5414 whichis used to mask gold fingers on PCBs during wave soldering). Otherrepresentative examples of materials that could be used as dielectricsinclude silicones, polyurethanes, acrylics, and other spin-coatable ordepositable dielectrics.

Generally, it is desirable to minimize the thickness of insulator 22 inorder to reduce the voltage required for actuation of the liquid.

Standoff Layers

It is also envisioned that additional layers of soldermask material maybe deposited and patterned to create physical structures on the PCBsurface such as wells and channels (not shown) for use in pooling ordirecting liquid flow.

Additional Processes Combination of Subtractive and Additive Processing

In a further embodiment, a combination of subtractive and additiveprocesses can be used to fabricate PCB droplet manipulation boards ofthe present subject matter. Subtractive processes can be used tofabricate a multilayer board that defines all the electrical routing andinterconnections to the droplet control electrodes. A patternabledielectric layer can then be applied. Vias can be patterned in thisdielectric by laser drilling or photomasking. In one embodiment, LPI canbe used as a dielectric. The electrode pad exposed in the hole can beoptionally plated to make it planar with the dielectric surface. At thispoint, an additive process can be used to define all electrodes usingelectroless copper deposition as a smaller line spacing could beobtained.

Post Processing

A finished device can include a combination of standard PCB processesand non-standard processes. For example, a one-step hydrophobic coatingmay be applied to a finished PCB to facilitate transport of droplets.Furthermore, the use of soldermask as a dielectric might be undesirablefor certain applications, in which case uninsulated PCBs couldsubsequently be coated with specialty materials not available in astandard PCB process. However, in such cases, the use of a PCB as thestarting substrate and PCB processes to form the conductive traces stillprovides many, if not most, of the benefits of a fully PCB-compatibleprocess.

In one embodiment, all the conductor lines required for electricalrouting can be fabricated on a multi-layer PCB. Some or all of the outerlayer of copper can then be removed by polishing or chemical etching.This PCB, which contains all the electrical wiring required for dropletmanipulations, can then serve as a substrate for further processing topattern drive and reference electrodes with finer line spacing. In orderto obtain fine line spacing, the control electrodes may be patternedusing semiconductor processing techniques including thin film depositionand photolithography.

Plating up of Coplanar Reference Elements

In an embodiment where reference electrodes 18 are also patterned in thesame layer as drive electrodes 16 (see, for example, FIGS. 1A-1D), therecan be a significant dimple in the LPI soldermask as it only covers thedrive electrodes and leaves the reference electrodes open. This dimplecould affect the reliability of operation as the droplet may not be incontact with the reference element. In this case, the referenceelectrodes can be plated up such that the surface of the referenceelement is planar with the LPI soldermask (not shown). This plating stepcould be performed prior to the surface finish with copper or nickel.

Reference Electrodes on Outer Surface

In one embodiment, after all the copper electrodes are formed asdescribed hereinabove, the LPI coating can then be used as aninter-level dielectric and another copper layer can be patterned overthe LPI to serve as reference electrodes. The dielectric can also be athin (2 mil or less) prepreg PCB board in a typical multilayerconstruction or it could be a flex board with copper features to serveas reference electrodes on the outermost layer. The copper layer justbeneath this outermost copper layer has copper features that define thedrive electrodes.

Integration of Electronics and Detection onto the PCB

In a further embodiment, it is envisioned that the PCB of the presentsubject matter may also consist of electronic components in the areaswhich are not used for liquid handling. The electronic components caninclude microcontrollers, relays, high voltage multiplexers, voltageconverters (DC-DC to step up the voltage, DC-AC, AC-DC, etc.),electro-optical elements such as LEDs, photodiodes, photo-multipliertubes (PMT), heating elements, thermistors, resistance temperaturedevices (RTDs), and other electrodes for electrochemical measurements.Copper traces can also be used for impedance measurements of thedroplets. Resistive heating elements are realized by meandering coppertraces and the resistive heating characteristics will be dependent onthe dimensions of the copper lines. In one embodiment, a PCB containingan optical detector, such as a PMT or a photodiode, can be used as aparallel plate to form a sandwich with the droplet manipulation PCBboard. In another embodiment, gold coated electrodes obtained in astandard PCB process can be used for electrochemical measurements.

Drill Holes for Fluidic Input/Output

Mechanically drilled holes on a PCB are used typically for affixing orsecuring the board to another surface. It is further envisioned in thePCB microfluidic chip of the present subject matter that these drillholes can be used to serve as fluidic input/output ports for theaddition and removal of liquids to or from the surface of the PCBsubstrate. It is further envisioned that these drill holes can be matedwith a source of liquid including, but not limited to, flexible tubing,syringes, pipettes, glass capillary tubes, intra-venous line, ormicrodialysis lumen. The liquid in these tubes can be driven by pressureor any other means. A continuous flow of liquid from the tubing can beinterfaced to the PCB through these drill holes which can be discretizedinto droplets either directly from the flow or through an intermediatereservoir on the PCB.

For instance, in one embodiment, metallized drill holes (see, forexample, drill holes 32 in FIGS. 9A-9B) can be located adjacent tocontrol electrodes in order to serve as fluidic input/output ports forplacing or removing liquids onto the electrode surface. In anotherembodiment, non-metallized drill holes (see, for example, drill holes 34in FIGS. 9A-9B) can be provided for fluidic input and output and can beconnected to a channel etched in solder mask which then leads to areservoir (not shown). This reservoir can have electrodes fordispensing, such as by using electric-field mediated droplet dispensingtechniques. In yet another embodiment, metallized drill holes providedfor fluidic input/output can be covered by a dielectric and in additionhave concentric rings of electrodes around the drill hole. In this case,droplets may be dispensed radially out of the hole by pressuring theliquid through the hole and then using an electric field to dispensedroplets on the electrodes. In an additional embodiment, drill holes canbe used to output liquid into a waste reservoir or any other containeroff-chip by collecting the droplets in the hole area and allowing thedroplets to drip by gravity into a container placed underneath the hole.

Out of Plane Droplet Extraction from Via Holes

Generally, droplets moved on apparatuses of the present subject matterare manipulated within a horizontal plane in a sandwich structure withone or both of the plates comprising PCBs. In a further embodiment, theholes drilled on a PCB could be used to extract droplets out of thesandwich structure in a vertical plane. Droplets can be extractedthrough the holes in a variety of ways. In one method that exploits thepressure difference between a droplet confined in a sandwich structureand a large hole, droplets could be passively pushed through a hole witha diameter larger than the radius of the droplet by just positioningunderneath the hole. Droplets could also be extracted by electricalmeans where another plate is added to the sandwich structure and thedroplets can be pulled out of one sandwich structure into thenewly-formed sandwich structure by applying an electric potential. Inthis case, to simplify the extraction process, a sandwich structure canbe formed between a coplanar PCB substrate and another substrate withelectrodes. While both these plates form a parallel-plate arrangement,the droplets will be touching only the coplanar PCB substrate and willmove vertically onto the other substrate when an electric potential isapplied on the other substrate to electrostatically pull the droplet outof plane. Droplet could also be moved vertically with gravity forstamping onto another plate. Applications for such vertical actuation ofdroplets include DNA or protein stamping applications. Dropletsextracted from such holes can also be used to increase the path lengthfor absorbance measurements and to transport into another sandwichstructure to enable transport in another layer.

Biochemical Synthesis and Analysis

A number of biochemical reactions can be performed through themanipulation of liquids on PCB substrates as disclosed in the presentsubject matter. As disclosed herein, the present subject matter providesan apparatus for detecting a target analyte in sample solutions byoptical and electrical means of detection. The sample solution maycomprise any number of items, including, but not limited to, bodilyfluids (including, but not limited to, blood, sweat, tears, urine,plasma, serum, lymph, saliva, anal and vaginal secretions, semen, ofvirtually any organism, with mammalian samples being preferred and humansamples being particularly preferred); food and environmental samples(including, but not limited to, air, agricultural, water, and soilsamples); biological warfare agent samples; research samples; purifiedsamples, such as purified genomic DNA, RNA, proteins, cells, etc.; andraw samples (bacteria, virus, fungus, etc). The types of assays that canbe performed on the PCB substrate as disclosed herein include enzymaticassays, DNA amplification isothermally or by thermocycling,immunoassays, including sandwich and homogeneous arrangements, andcell-based assays with optical and electrical means of detection. Theanalytes measured in the physiological samples includes metabolites,electrolytes, gases, proteins, hormones, cytokines, peptides, DNA, andRNA.

In one embodiment, a human physiological sample can be input into areservoir on the PCB. The reservoir could be defined by the dry filmsoldermask. The sample can then be dispensed into droplets which will bemixed with the appropriate reagent droplets provided on the PCB or inputonto the PCB. Some of the enzymatic assays can then be monitoredoptically (e.g., by absorbance, reflectometry, fluorescence, andluminescence). In the case of absorbance, the via holes can be filledwith an optically transparent material so that the light can passthrough a droplet positioned on one of these via holes for absorbancemeasurements.

In another embodiment, biochemical samples can also be synthesized on aPCB substrate using droplet manipulation techniques described herein.For example, on the PCB, a number of protein droplets can be dispensedfrom a reservoir and mixed with different reagents and incubated toautomate finding conditions to crystallize a protein.

Sidewall Transport

In a further embodiment, copper traces with thickness on the same orderas the droplet height can be used so that the droplet is containedbetween the traces lying on the same substrate and covered with aninsulator. The droplet is actuated through electric fields appliedprimarily in the plane of the substrate rather than perpendicular to it.Unlike the coplanar arrangement, where the droplet sits on the coplanardrive and reference electrodes and parallel-plate arrangement, where thedroplet is sandwiched between the drive electrodes on a substrate and acommon reference electrode on a parallel substrate, in this structure adroplet is sandwiched between the coplanar drive and referenceelectrodes.

Specific Embodiment

While general embodiments and processes of the present subject matterhave been discussed hereinabove, more specific embodiments offabrication of an apparatus to manipulate micro-volume liquid sampleswherein the apparatus comprises a printed circuit board substrate willnow be discussed.

In a preferred embodiment, a FR-4 substrate is laminated with a ¼ Oz (9μm) copper foil on both sides. 8 mil via holes are drilled through thesubstrate. These via holes are then electroplated with copper and filledwith soldermask or an epoxy. Preferably, the via holes are button-platedto a thickness of about 5 μm where the via holes are specifically platedwhile the rest of the board is covered by a mask. The buttons aremechanically planarized and then the via holes are filled withsoldermask or a non-conductive epoxy. After processing the via holes, aflash plating step is performed to a thickness of less than 5 μm. Incase unfilled via holes are required, another step of drilling can beperformed to obtain unfilled holes and plating is performed ifnecessary. At this stage, the designed electrode pattern is transferredonto the copper with a minimum line spacing of 2 mils by etching itthrough a mask. LPI is patterned and coated to a thickness of about 0.5mils. Finally, a dry film soldermask is laminated and patterned to formthe physical structures (e.g., wells and/or channels) to hold liquidsand also to serve as a stand off material. In other embodiments, thestand off layer can also be obtained by using one of more LPI soldermaskcoatings or by laminating and etching a copper foil.

Experimental Testing and Results

Experiments were conducted wherein a two-layer single-board design foran electric field-mediated droplet manipulator as disclosed herein wassubmitted to a commercially available electronics PCB manufacturer andtested. The design consisted of arrays of different control electrodeshapes for transport and mixing of liquid droplets as well asspecialized electrode shapes for dispensing of droplets from a largerliquid volume. The electrodes were connected to contact pads byconductive traces patterned in the same layer of copper on the surfaceof the PCB. Where necessary, the traces were routed between the twosides of the board using conventional vias at remote locations from thecontrol electrodes. Several different chip designs and interconnectionschemes were tested.

Some chips contained multiple copies of a single linear array ofelectrodes where the corresponding elements in each copy of the arraywere connected to the same electrical signal—thus multiple identicalarrays could be controlled simultaneously. Other chips contained anelectrode “bus” or conveyor structure where every fourth electrode in acontiguous line of control electrodes was connected to the same controlsignal. The use of such a structure allows arbitrarily long transportpathways to be controlled using a fixed number of control signals.Multiple droplets can be switched onto or off of the bus andsynchronously transported. The contact pads were arranged along the sideof the PCB and were designed to be contacted either using a standardedgecard connector or a standard SOIC test clip.

FIGS. 6, 7, 8A-8B, and 9A-9B illustrate several examples of chipsmanufactured for experimental purposes. FIG. 6 illustrates the frontside of a PCB chip used to test droplet transport performance ofdifferent shapes (circular 16 a, square 16 b, star with small curvature16 c, star with larger curvature 16 d) (see FIG. 7) and sizes of controlelectrodes (results discussed in reference to FIGS. 10-12 below). Thechip illustrated in FIG. 6 contains 16 different linear electrodearrays. FIGS. 8A and 8B are front and back views of a chip designfeaturing a three-phase droplet conveyor as well as other structures fordispensing from an on-chip reservoir, storing and mixing droplets. Vias24 are used to route the electrical signals from the backside of the PCBto the control electrodes on the front side and electrical contact ismade through edgecard connector socket 28 located along one side of thePCB. FIGS. 9A and 9B are front and back views of another chip designfeaturing a three-phase droplet conveyor as well as other structures fordispensing from a fluidic input/output port 32, storing and mixingdroplets. Vias 24 are used to route the electrical signals from thebackside of the PCB to the control electrodes on the front side andelectrical contact is made through an array of pads designed to becontacted using an SOIC test clip 29.

The arrays of control electrodes were designed with a pitch of either1.0 mm or 1.5 mm and a nominal 2 mil spacing between adjacentelectrodes. The substrate material was FR-4 with ¼ oz. copper cladding.The copper was patterned to form the control electrodes, traces andcontact pads. The nominal minimum linewidth/spacing of the process usedwas 2 mil/2 mil, which was the spacing used between adjacent electrodesas well as the trace width between the control electrodes and contactpads. A liquid photoimageable soldermask material, CARAPACEL® EMP 110(available from Electra Polymers & Chemicals, Ltd.) was used as theelectrode insulator. The nominal thickness of the soldermask insulatorwas 0.6 mil. After the PCBs were received from the manufacturer a thinhydrophobic coating of TEFLON® AF was applied to the top surface of thechip. TEFLON® AF was applied by spin-coating a 1% solution in FC-75 at3000 rpm for 20 seconds onto the PCB surface, followed by a 30 minutecure at 150° C.

The PCBs were assembled as a sandwich with an indium-tin-oxide coatedglass top-plate. The top-plate was also coated with a thin layer ofTEFLON® AF so that all interior surfaces in contact with the dropletwere hydrophobic. The conductive indium-tin-oxide film on the top-platewas used as the reference electrode. The PCB and top-plate wereseparated by a gap of approximately 0.8 mm. One or more droplets ofelectrolyte (0.1 M KCl) were injected into the sandwich structure anddeposited on a control electrode. The volume of the droplet wassufficient to cover a single electrode and was approximately 2.2 μL forthe 1.5 mm pitch electrodes and 1.1 μL for the 1 mm electrodes. Theremaining volume between the two plates was filled either with air orwith low viscosity (1 cSt.) silicone oil.

Referring to FIGS. 6, 7, and 10-12, tests on the transportation ofdroplets by sequential activation of the control electrodes as describedin U.S. Pat. No. 6,911,132 and U.S. Patent Application Publication No.2004/0058450, both to Pamula et al., were performed. Using a PCB similarto that shown in FIG. 6, tests were performed on 4 different electrodeshapes (circular 16 a, square 16 b, star with small curvature 16 c, starwith larger curvature 16 d) (see FIG. 7) in each of the two electrodesizes (1.0 mm and 1.5 mm pitch).

For each electrode size and shape the maximum rate at which dropletscould be transported between adjacent control electrodes was determinedas a function of the applied voltage, as shown in FIGS. 10 and 11.Droplets were successfully transported at voltages less than 40 V (for1.0 mm electrode size) with transport speed increasing with voltagebeyond that threshold. Higher voltages were required for dropletactuation than previously reported in other systems because of the useof the thicker soldermask insulator. For instance, the soldermaskinsulation is approximately 16 times thicker than the insulation usedwith previous microfabricated devices, and therefore approximately four(4) times as much voltage is required owing to the electrostatic energy(½CV²) dependence of the transport mechanism.

As expected, beyond the initial threshold voltage, the speed oftransport and consequently the maximum speed at which the droplet couldbe switched increased with voltage. The range of voltage tested was fromroughly 0-200 V for the 1.5 mm electrodes and 0-100 V for the 1.0 mmelectrodes, and droplet transport rates up to 24 Hz were observed. Theresulting test curves exhibited an expected general shape—the higher thevoltage applied the higher the possible transfer frequency. However, thecurves for the 1.5 mm electrodes (FIG. 10) were not very smooth andthere appears to be a significant effect of the shape of the electrode.Alternatively, the curves for the 1.0 mm electrodes (FIG. 11) are quitepredictable and do not exhibit large dependence on electrode shape. Inaddition, there was a scaling effect where the threshold voltages of the1.0 mm electrodes were 10-20 V lower than the 1.5 mm electrodes atcorresponding frequencies.

As shown graphically in FIG. 12, a further test was performed todetermine the stability of droplet transport over time. A droplet wasprogrammably cycled across four 1.5 mm square electrodes at the minimumvoltage required to sustain transport at a switching frequency of either4 Hz or 8 Hz. At five minute intervals the minimum voltage forcontinuous transport was tested and adjusted. The tests which wereperformed for an hour or more demonstrate a general trend of increasingvoltage requirement over time which is presumably due to degradation ofthe insulator and contamination of the insulator surface. However, ineach case over 20,000 cycles of droplet transport were performed duringthe experiment.

With reference to the graph shown in FIG. 13, tests were also conductedto determine the minimum voltage requirements for droplet transport at agiven switching frequency. Digital microfluidic chips for both an open(i.e., co-planar without a top plate) and a confined (i.e., bi-planarwith a top plate) structure on a PCB were used (see FIGS. 1B and 4B,respectively).

Electrodes (1.5×1.5 mm²) were patterned in copper to a final thicknessof ˜25 μm. 150 μm via holes were drilled into each electrode to provideelectrical contacts to the backside of the board. Grounding rails werepatterned alongside all the drive electrodes to provide a continuousground connection to the droplets, and a liquid photoimageable (LPI)solder mask (˜17 μm) was patterned to act as an insulator, exposing onlythe rails. As the only post-processing step, TEFLON® AF was brush-coatedto render the surface hydrophobic. Droplets of a polarizable andconducting liquid (1 M KCl) were transported in both the open(co-planar) and confined (bi-planar) systems. For the open system, eachdroplet was 6 μl in volume and a small drop of silicone oil (2 μl) wasadded and appeared to surround the droplet. For the confined system, thevolume of each droplet was 2.5 μl, and the entire chip was filled withsilicone oil to facilitate transport.

The minimum actuation voltages required to successfully transportdroplets were measured for each system at switching frequencies rangingfrom 1 to 32 Hz. As shown graphically in FIG. 13, the operating voltagesfor droplets in the confined (bi-planar) and open (co-planar) systemsranged from 140-260V and 125-220V, respectively, depending on theswitching frequency of the droplets. This appears to suggest thatdroplet actuation is facilitated by the absence of a confining topplate, possibly due to the reduced drag experienced by the unconfineddroplet. Electrolysis of the droplets, typically due to impropercoverage of the insulator, was not observed using LPI solder mask as aninsulator up to the maximum tested voltage of 350V. Insulator charging,however, was experienced beyond 300V.

Referring to FIGS. 14A-14D, top views of various sequences oftime-lapsed images demonstrating droplet transport and mixing are shown.FIGS. 14A-14B depict droplet transport and mixing, respectively, fordroplets confined by a top plate (600 μm) (bi-planar). FIGS. 14C-14Ddepict droplet transport and mixing, respectively, for droplets in anopen system (co-planar). Mixing was performed at a switching frequencyof 8 Hz and was completed within 5 seconds for two 2.5 μl “confined”droplets, and within 1.8 seconds for two 6 μl droplets in an “open”system. Thus, the mixing rates (volume per unit time) observed in theopen (co-planar) system is nearly seven times greater than in theconfined system (bi-planar). This improved mixing may be attributed toincreased circulation experienced within the thicker droplet, ascirculation has previously been shown to worsen as droplets get thinner.

REFERENCES

The references listed below are incorporated herein by reference to theextent that they supplement, explain, provide a background for or teachmethodology, techniques and/or processes employed herein. All citedpatent documents and publications referred to in this application areherein expressly incorporated by reference.

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CONCLUSION

The foregoing detailed description of embodiments refers to theaccompanying drawings, which illustrate specific embodiments of theinvention. Other embodiments having different structures and operationsdo not depart from the scope of the present invention. The term “theinvention” or the like is used with reference to certain specificexamples of the many alternative aspects or embodiments of theapplicants' invention set forth in this specification, and neither itsuse nor its absence is intended to limit the scope of the applicants'invention or the scope of the claims. This specification is divided intosections for the convenience of the reader only. Headings should not beconstrued as limiting of the scope of the invention. The definitions areintended as a part of the description of the invention. It will beunderstood that various details of the present invention may be changedwithout departing from the scope of the present invention. Furthermore,the foregoing description is for the purpose of illustration only, andnot for the purpose of limitation.

1. An apparatus for manipulating droplets, the apparatus comprising: (a)a substrate; (b) multiple arrays of electrodes disposed on thesubstrate, wherein corresponding electrodes in each array are connectedto a common electrical signal; and (c) a dielectric layer disposed onthe substrate first side surface and patterned to cover the electrodes.2. The apparatus of claim 1 further comprising a hydrophobic layerdisposed on the dielectric layer.
 3. The apparatus of claim 1 furthercomprising an electrode selector configured for dynamically creating asequence of array electrode activation, whereby a droplet disposed onthe substrate is electrically manipulated.
 4. The apparatus of claim 1further comprising a top plate arranged in a parallel orientationrelative to the substrate and separated therefrom to define a gapbetween the top plate and the substrate.
 5. The apparatus of claim 4further comprising a droplet in disposed in the gap and arranged to bemanipulated using electrodes in the electrode arrays.
 6. The apparatusof claim 5 wherein the gap comprises a liquid which is immiscible withthe droplet.
 7. The apparatus of claim 4 further comprising dropletsdisposed in the gap, wherein the droplets are arranged synchronouslytransported on the multiple arrays using a fixed number of controlsignals.
 8. The apparatus of claim 7 wherein the gap comprises a liquidwhich is immiscible with the droplet.
 9. The apparatus of claim 1wherein the arrays of electrodes comprise multiple copies of a singlelinear array of electrodes.
 10. The apparatus of claim 9 wherein eachcopy of the array is connected to the same electrical signals.
 11. Theapparatus of claim 1 wherein the substrate comprises a printed circuitboard.
 12. An apparatus for manipulating droplets, the apparatuscomprising: (a) a substrate; (b) a top plate arranged in a parallelorientation relative to the substrate and separated therefrom to definea gap between the top plate and the substrate; (c) multiple arrays ofelectrodes disposed on the substrate, wherein corresponding electrodesin each array are connected to a common electrical signal; and (d) adielectric layer disposed on the substrate first side surface andpatterned to cover the electrodes.
 13. A method of manipulating adroplet, the method comprising: (a) providing an apparatus comprising:(i) a substrate; (ii) multiple arrays of electrodes disposed on thesubstrate, wherein corresponding electrodes in each array are connectedto a common electrical signal; and (iii) a dielectric layer disposed onthe substrate first side surface and patterned to cover the electrodes;(b) providing a droplet on the substrate; and (c) activating electrodesof the multiple arrays of electrodes to cause the droplet to bemanipulated.
 14. The method of claim 13 wherein the apparatus furthercomprises a hydrophobic layer disposed on the dielectric layer.
 15. Themethod of claim 13, further comprising using an electrode selector todynamically create a sequence of array electrode activation, therebycausing the droplet to be electrically manipulated.
 16. The method ofclaim 13 wherein the apparatus further comprises a top plate arranged ina parallel orientation relative to the substrate and separated therefromto define a gap between the top plate and the substrate.
 17. The methodof claim 16 wherein the gap comprises a liquid which is immiscible withthe droplet.
 18. The method of claim 13 wherein the arrays of electrodescomprise multiple copies of a single linear array of electrodes.
 19. Themethod of claim 18 comprising using a common set of electrical signalsto control each copy of the array.
 20. An apparatus for manipulatingdroplets, the apparatus comprising: (a) a substrate; (b) a top platearranged in a parallel orientation relative to the substrate andseparated therefrom to define a gap between the top plate and thesubstrate; (c) multiple arrays of electrodes disposed on the substrate,wherein corresponding electrodes in each array are connected to a commonelectrical signal; and (d) a dielectric layer disposed on the substratefirst side surface and patterned to cover the electrodes.